P23: Special oil for chip repair
Specially developed for the repair of mobile phone motherboard chips and middle layers, using high activity, low halogen, and lead-free materials with moderate fluidity
High-temperature heating, good material wettability, the perfect solution for chip disassembly and soldering, completely non-destructive without damaging the motherboard and chip

P59: Special soldering oil for chip reflow
Specially developed for mobile phone motherboard chips and mid-layer soldering, using medium activity, lead-free and halogen-free materials with strong flowability
Chip reflow has a significant effect, which can enhance the adhesion between chip pins and solder pads, enabling automatic homing and alignment of chip reflow, especially for BGA reflow, with a more significant homing effect