Features

1. Antioxidant Properties: The flux paste contains antioxidants that prevent the formation of oxides on metal surfaces, ensuring a clean and effective solder joint.

2. High Activity: It is highly active, making it suitable for difficult-to-solder surfaces. It helps in removing oxidation and impurities from the surfaces, providing better wettability and soldering efficiency.

3. No-Clean Formula: This flux paste often features a no-clean formula, meaning that any residues left after soldering are non-corrosive and do not need to be cleaned off, simplifying the post-soldering process.

4. Wide Application Range: It can be used for a variety of applications, including PCB repair, component soldering, and rework operations. It is suitable for both manual and automated soldering processes.

5. Consistency: The paste has a thick, gel-like consistency, making it easy to apply precisely where needed without running or spreading too much.

6. Temperature Stability: It is designed to withstand high soldering temperatures, ensuring it remains effective throughout the soldering process.