MC LW50 138C Solder Paste BGA 50g Mechanic

The MC LW50 138°C solder paste BGA, 50g is a low-temperature solder paste for BGA soldering and rework. It melts at 138°C, which helps protect heat-sensitive parts during repair. The 50g package suits repair and assembly work.

Designed for BGA

BGA components need consistent paste and controlled heat. A low-melting paste like the LW50 can reduce thermal stress on the board and nearby parts when you reflow a chip.

Product Details

• Brand: Mechanic
• Model: LW50
• Melting point: 138°C
• Net weight: 50g
• Type: BGA solder paste

Best Uses

• BGA chip rework and reballing
• Phone motherboard repair
• Low-temperature soldering projects

Tips for Use

Use a stencil that matches the chip, and apply the paste evenly. Follow a suitable reflow profile for your equipment, and check the product images for packaging details.

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