Mechanic No Clean BGA Tin Solder Flux Paste is high bond strength and PH value-neutral. MCN-UV80 welding flux paste’s insulation is strong with welding surface smooth. This rosin soldering flux paste is the best for IC and PCB for no corrosive. This mechanic flux paste has a boiling point only slightly higher than the melting point of the solder. The MECHANIC paste is for mobile phones, PC cards, and other sophisticated electronic chip-level help welding.

Features:

• 100% brand new and high quality.
• High synthetic BGA Solder Paste Tin Rosin-Based Flux Paste Cream.
• PH value neutral, insulation is strong, welding surface smooth.
• Professional Soldering Tin Flux for PC Cards Electronic Chip-level Welding.
• Its boiling point only slightly higher than the melting point of the solder.
• Unique recipes, perfect performance, easy to weld, solder bright and full, no weld, false welding and so on.
• Good soldering and welding tools.
• IC and PCB for no corrosive
• Super compacity: Applicable to PCB, BGA, SMD, PGA repair, Soldering, etc.
• Rosin-based Solder Paste.

Specifications:

1. Material: Plastic+ Rosin-based solder paste
2. Size: 80g
3. Type: Rosin-based BGA solder flux cream
4. Viscosity: 0.2Pas
5. Granularity: 0.22um
6. Application: for Phone BGA Board Soldering Fixing
7. Function: PC Cards Electronic Chip-level Welding