Mechanic XG30 183℃ Special (BGA) Solder Paste 16gm
MECHANIC SOLDER PASTE ROOM TEMPERATURE MELTING POINT 183 FLUX EASY WELDING STRONG MEDIUM TEMPERATURE SOLDER PASTE.
New technical support, unique chemical formula provides excellent wetting, to ensure high reliability.
Adapted to the mobile phone repair industry, computer digital service industries and high-presicion circuit board soldering SMT/BGA soldering processes.
The viscosity is moderate, there is almost no patch collapse, and the components do not shift.
Good wettability & Good weldability High-end quality, a unique formula, perfect performance.
Suitable for a variety of welding environments, a wide range of applications, with high compatibility.
The storage time is up to 12 months in a refrigerated environment. Unique high-quality solder tin paste(the best configuration ingredients: Sn42/Bi58) make the adhesion is long-lasting, it is not easy to dry, and the viscosity time is up to 48 hours.
The residue is colorless and transparent, does not affect t he detection, disposable and excellent cleaning performance.
Use of efficient energy thixotropic agents, printing and preheating collapse, special solder ensure a good printing and fine pattern.
Uncompromising performance in an ultra light ultra body, heavyweight performance without the weight. Fine and flexible packaging, delicate appearance.
Specification:
Easy to use
Low melting – point
High-Quality Soldering Additives & Activators for effective soldering
Useful for general purpose soldering, electrical wires, components, and cables, etc.
