Choosing good quality BGA reballing,it is high roundness, high purity, high accuracy, and high brightness. Unit rebelling diameter tolerance is minuteness and low oxygen.

Good conductive and welding performance, better heat dissipation, improving consumer electronic characteristics,in which made packaging thinness,  packaging area narrowness, binding points distance shortener.

no need for bending pins, to improve product composition rate, It is a kind of high-density surface assembly and packaging technology, which satisfies short, small, light, and thin requirements.

ESD glass bottle packaging, improves the storage rate

Application

It is mainly used for IC package specific materials, suitable for DIP SOJ SOP TSOP QFP BGA CSP and others craftwork