[su_tabs vertical=”yes”][su_tab title=”Features” disabled=”no” anchor=”” url=”” target=”blank” class=””]
● Flux Type: UV-559
● Volume: 10ml/10cc
● Dimension: 93 x 33 x 23mm
● Material: the mixture of high-quality alloyed powder and resinic pasty flux, it can avoid the pale yellow residue.
● Color: Yellow
● Insulated: Yes
● With Needle Tip: Yes
● Application: for soldering and reballing of computer and phone chips.
● Advantage: Good immersion and high intensity joint.
● Function: for PCB , BGA , PGA reworkin.
● 100%: New Type, high quality.
[su_tab title=”Specifications ” anchor=”” url=”” target=”blank” class=””]
●Professional advanced UV-559 BGA soldering paste flux+squeeze tube +free needle tip.
●100% new brand and high quality.
●Good immersion and high intensity joint.
●Easy to peel off with hands or tweezers, leave no residue.
●Won’t oxidating gold, copper, phosphorus, bronze, oxidation.
●Prevent contamination during assembly.
●UV-559: high viscosity no-clean flux, reprocessing PCB, BGA, PGA , for soldering computer/phone chips.
●UV-559 is the mixture of high-quality alloyed powder and resinic pasty flux, it can avoid the pale yellow residue.
●High soaking high strength joints.
●No-toxic, no-corrosive, strong ability of insulation.
●Good insulation and smooth welding surface.
●No deterioration no dry.
●No poison no orrosion, no damage to parts