Features & Functions
Two-stage trigger switch (PAT.P)
Pulling the trigger (lightly) activates the first stage switch. The pump starts, and the air pressure decreases in the vacuum chamber.
Next, pulling the trigger fully activates the second stage. The open-valve will open, and the solder is sucked up at once by the negative pressure in the vacuum chamber.
400% More Suction Capacity
With open-valve mechanism
Ceramic Heater with Internal Sensor
A wide range for terminals, connectors and flat ICs
Superior Temperature-Control Circuit
To keep the temperature constant during desoldering
Zero Volt Switch Circuit
Reduces noise during heater ON/OFF
Replaceable Cartridge Filter
Makes changing the filter easy
Vacuum pressure compared with other goot models
The open-valve allows the device to reach vacuum pressure of -0.06MP (approx.-450mmHg) in only 0.1second. (about 4 times faster than our TP-200AS).
SUCTION CAPACITY COMPARISON
The arrow indicates solder residue.
NOZZLE TEMPERATURE-RECOVERY FEATURES
Soldering time is approx. 2 seconds / 5×5mm land (with PX-2RT-B tip)