Features & Functions
OPEN-VALVE MECHANISM
Two-stage trigger switch (PAT.P)
Step 1
Pulling the trigger (lightly) activates the first stage switch. The pump starts, and the air pressure decreases in the vacuum chamber.
Step 2
Next, pulling the trigger fully activates the second stage. The open-valve will open, and the solder is sucked up at once by the negative pressure in the vacuum chamber.
400% More Suction Capacity
With open-valve mechanism
Ceramic Heater with Internal Sensor
A wide range for terminals, connectors and flat ICs
Superior Temperature-Control Circuit
To keep the temperature constant during desoldering
Zero Volt Switch Circuit
Reduces noise during heater ON/OFF
Replaceable Cartridge Filter
Makes changing the filter easy
Vacuum pressure compared with other goot models
The open-valve allows the device to reach vacuum pressure of -0.06MP (approx.-450mmHg) in only 0.1second. (about 4 times faster than our TP-200AS).
SUCTION CAPACITY COMPARISON
The arrow indicates solder residue.
NOZZLE TEMPERATURE-RECOVERY FEATURES
Soldering time is approx. 2 seconds / 5×5mm land (with PX-2RT-B tip)